Thermodynamic Modeling of Copper Ore Treating into Matte Using Borate Containing Materials

Authors

  • Alexander Akberdin Zh. Abishev Chemical-Metallurgical Institute, Karaganda, Kazakhstan
  • Alexsander Kim Zh. Abishev Chemical-Metallurgical Institute, Karaganda, Kazakhstan
  • Ruslan Sultangaziyev Abylkas Saginov Karaganda Technical University, Karaganda, Kazakhstan | Zh. Abishev Chemical-Metallurgical Institute, Karaganda, Kazakhstan
  • Alexey Orlov Zh. Abishev Chemical-Metallurgical Institute, Karaganda, Kazakhstan
  • Anel Jashibekova Abylkas Saginov Karaganda Technical University, Karaganda, Kazakhstan | Zh. Abishev Chemical-Metallurgical Institute, Karaganda, Kazakhstan
Volume: 15 | Issue: 4 | Pages: 25041-25047 | August 2025 | https://doi.org/10.48084/etasr.11401

Abstract

This work examines the possibility of incorporating borate-containing materials in order to improve the granule strength and reduce the copper losses to slag. A phase diagram of the Fe-S-Cu system was constructed, and a mathematical model with a numerical calculation program were created. Using complete thermodynamic modeling, the influence of the boric anhydride and borate ore on the pelletizing, drying, roasting, and matte production was analyzed. B2O3 enhanced the wet granule strength by forming crystalline hydrates (H2O∙B2O3), which dehydrated at 285 K and melted at 723 K, creating a strong sinter upon cooling. During smelting, boron-containing materials increased process efficiency and they decreased matte losses, creating low-melting, mobile slags. Additionally, borate ore containing montmorillonite ensured sufficient wet granule strength for transport, and its low-melting nature led to liquid phase formation during firing, producing a strong sinter upon cooling.

Keywords:

thermodynamic modeling, copper ore, granules, drying, roasting, matte

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How to Cite

[1]
A. Akberdin, A. Kim, R. Sultangaziyev, A. Orlov, and A. Jashibekova, “Thermodynamic Modeling of Copper Ore Treating into Matte Using Borate Containing Materials”, Eng. Technol. Appl. Sci. Res., vol. 15, no. 4, pp. 25041–25047, Aug. 2025.

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