1.
Khoa NM, Tung DD. Modeling for Development of Simulation Tool: Impact of TCSC on Apparent Impedance Seen by Distance Relay. Eng. Technol. Appl. Sci. Res. [Internet]. 2018 Oct. 13 [cited 2022 Jun. 27];8(5):3332-7. Available from: https://www.etasr.com/index.php/ETASR/article/view/2199