KHOA, N. M.; TUNG, D. D. Modeling for Development of Simulation Tool: Impact of TCSC on Apparent Impedance Seen by Distance Relay. Engineering, Technology & Applied Science Research, Greece, v. 8, n. 5, p. 3332–3337, 2018. DOI: 10.48084/etasr.2199. Disponível em: https://www.etasr.com/index.php/ETASR/article/view/2199. Acesso em: 2 jul. 2022.